blind and buried vias

KINGSIGNAL'S BLIND AND BURIED VIAS

Blind and buried vias are essential techniques for creating connections between layers of a printed circuit board (PCB), especially when maximizing space is a priority. Typically, a blind via links the outermost layer to one or more inner layers without passing through the entire PCB.

In contrast, buried vias connect two or more inner layers without reaching the outer layer. While these concepts might seem straightforward, there are various rules and limitations that dictate the use of these vias, making the choice between buried and blind vias important.

Kingsignal can evaluate your engineering requirements, spatial constraints, and the functional needs of your PCB to help you minimize costs using buried and/or blind vias.

BURIED VIAS V.S. BLIND VIAS



ADVANTAGES

The main benefit you’ll get from blind and buried via fabrication is that you’re able to meet density requirements and constraints for lines and pads on your design without increasing the overall layer count or the size of your board. They’re a great option for saving space and meeting extremely tight design tolerances.

Vias also help designers manage the hole-to-pad ratio and limit the chance of breakout.

DISADVANTAGES

Cost is the main issue with blind and buried vias. Comparatively, you’ll typically see a reduced cost with buried vias vs. blind vias, but using either will likely increase the cost of your board significantly. The cost rises because you’re making a more complex board and introducing more steps in the manufacturing process, while making testing and precision checks more frequently.

Peck Drilling Blind Vias

Drill depth is crucial when creating vias, as drilling too shallow or too deep can severely affect the board’s performance. Improper depth can also lead to spurs and rough edges, which may cause additional issues.

However, companies can reduce costs by utilizing blind vias created through peck drilling. This technique involves repeatedly plunging the drill into the board to remove material buildup and prevent rough spots. By choosing Kingsignal, a master machinist in peck drilling, you can ensure that air is not trapped during the process, allowing for proper plating and reliable connections to internal layers.

CONTACT US

For customers who require new products with complex circuit boards and have tight release schedules, we provide technology and expertise from prototype to production. You can contact us through the methods below to discuss your project with our technical experts immediately. We will be in touch within 24 Reply within hours.
If you already have documentation for your PCB or PCBA related needs, please submit a quick quote for a free evaluation.

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